JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.

During the event, SK hynix showed off some of its AI memory products, including its new HBM3E 12-Hi stack memory which it started mass-producing in September, marking a significant milestone in the ...

SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...

Samsung has advanced LPDDR5X-PIM memory technology and commenced HBM4 mass production as it battles SK Hynix to regain its AI ...

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum) recently wrapped up in Shenzhen. Themed "AI Applications, Innovation Empowered, "GMIF2025 represented as a gathering of leading ...